◈ 矽光子 Silicon Photonics
Silicon Photonics
光電共封裝 (CPO) 與 800G+ 光收發 — 對位、耦合損耗、光譜量測一站到位。
Co-packaged optics (CPO) and 800G+ transceivers — alignment, coupling-loss, spectral measurement in one stack.
產業現況
矽光子被視為 AI 資料中心下一代核心，從 800G 光收發、CPO 到光學運算晶片，皆需要次微米級對位精度與低至 -60dB 等級的回損量測。
Silicon photonics underpins the next AI data-center wave: 800G transceivers, CPO, and photonic compute chips need sub-micron alignment and –60 dB-class return-loss measurement.
三大關鍵挑戰
光纖到 PIC 的對位需 active alignment + 即時 IL/RL 量測
Fiber-to-PIC alignment needs active alignment with live IL/RL measurement.
Wafer-level 量測需高密度自動化探針站
Wafer-level testing needs high-density automated probe stations.
溫度漂移會影響 wavelength 鎖定，須包含 thermal sweep 流程
Temperature drift impacts wavelength lock — thermal sweeps required.
LiQung 怎麼幫您
光學量測 (P1) + 顯微影像 (P3) — 同步 IL/RL 與對位影像回饋
Optical Metrology (P1) + Microscopic Imaging (P3) — sync IL/RL + alignment vision feedback.
AI 模型訓練 (S03) — 對位收斂 AI 加速 3~5 倍
AI Model Training (S03) — 3–5× faster alignment convergence.
SaaS 平台 (P7) — Wafer map + IL/RL heatmap 即時呈現
SaaS Platform (P7) — live wafer map and IL/RL heatmap visualization.
關鍵數字 + 標準
- IEC 61753
- IEC 61300
- Telcordia GR-468
- ISO/IEC 17025
準備好讓 AI 加入 矽光子 Silicon Photonics 產線了嗎？
Ready to bring AI into your Silicon Photonics line? 24h SLA · Free site assessment.