/ INDUSTRY
◈ Silicon Photonics
Co-packaged optics (CPO) and 800G+ transceivers — alignment, coupling-loss, and spectral measurement in one stack.
/ CONTEXT
Industry Snapshot
Silicon photonics underpins the next AI data-center wave: 800G transceivers, CPO, and photonic compute chips need sub-micron alignment and –60 dB-class return-loss measurement.
/ PAIN
Three Key Challenges
/ 01
Fiber-to-PIC alignment needs active alignment with live IL/RL measurement.
/ 02
Wafer-level testing needs high-density automated probe stations.
/ 03
Temperature drift impacts wavelength lock — thermal sweeps required.
/ SOLUTION
How LiQung Helps
/ S1
Optical Metrology (P1) + Microscopic Imaging (P3) — synchronized IL/RL plus alignment vision feedback.
/ S2
AI Model Training (S03) — 3–5× faster alignment convergence.
/ S3
SaaS Platform (P7) — live wafer map and IL/RL heatmap visualization.
/ STACK
Recommended Stack
Products
- P1 · Optical Metrology
- P2 · Laser Processing
- P3 · Microscopic Imaging
- P7 · Custom SaaS
- P8 · Cloud Monitoring
Custom Services
- S01 · Measurement Script Automation
- S03 · AI Model Training
- S04 · SaaS Platform Development
- S05 · Production-Line API
/ METRICS
Key Numbers & Standards
<0.5μm
Alignment repeatability
3–5×
AI convergence speedup
-60dB
Return-loss floor
800G+
Target throughput
Applicable Standards:
- IEC 61753
- IEC 61300
- Telcordia GR-468
- ISO/IEC 17025
Ready to bring AI into your Silicon Photonics line?
24h SLA · Free site assessment.