/ INDUSTRY
◉ Semiconductor
From wafer-level metrology to back-end package defect analysis — deep learning paired with microscopic imaging.
/ CONTEXT
Industry Snapshot
Semiconductor manufacturing now spans advanced nodes (<7nm) and advanced packaging (CoWoS, FOWLP). Inspection must reach hidden defects in TSVs, bumps, and underfills.
/ PAIN
Three Key Challenges
/ 01
Sub-micron precision needed for bump height/pitch in advanced packaging.
/ 02
Conventional AOI under-recalls on colored/textured wafers.
/ 03
Real-time OEE and predictive maintenance needed for equipment utilization.
/ SOLUTION
How LiQung Helps
/ S1
Confocal + dark-field microscopy (P3) plus AI defect classification (P6).
/ S2
Production-line API (S05) — SECS-GEM / OPC UA into EAP / MES.
/ S3
LSTM-Autoencoder predictive maintenance — 4–72h pre-failure alerting.
/ STACK
Recommended Stack
Products
- P1 · Optical Metrology
- P3 · Microscopic Imaging
- P6 · AI Vision Inspection
- P7 · Custom SaaS
- P8 · Cloud Monitoring
Custom Services
- S03 · AI Model Training
- S04 · SaaS Platform Development
- S05 · Production-Line API
- S06 · AI Consulting
/ METRICS
Key Numbers & Standards
<0.5μm
Microscopic resolution
≥98%
AI defect classification
<120ms
Inference latency
4–72h
Pre-failure alert window
Applicable Standards:
- SEMI E10
- SEMI E30 (GEM)
- SEMI E37 (HSMS)
- ISO/IEC 17025
Ready to bring AI into your Semiconductor line?
24h SLA · Free site assessment.